Download 3D IC Stacking Technology by Banqiu Wu, Ajay Kumar, Sesh Ramaswami PDF

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By Banqiu Wu, Ajay Kumar, Sesh Ramaswami

The most recent advances in 3-dimensional built-in circuit stacking technology

With a spotlight on business purposes, 3D IC Stacking Technology bargains entire assurance of layout, attempt, and fabrication processing equipment for three-d machine integration. every one bankruptcy during this authoritative advisor is written by means of specialists and information a separate fabrication step. destiny purposes and state-of-the-art layout power also are mentioned. this can be a vital source for semiconductor engineers and conveyable equipment designers.

3D IC Stacking Technology covers:

  • High density via silicon stacking (TSS) technology
  • Practical layout atmosphere for heterogeneous 3D IC products
  • Design automation and TCAD software ideas for via silicon through (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper...
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    Additional resources for 3D IC Stacking Technology

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    5), Park et al. (dielectric deposition—Chap. 6), Forster et al. (physical vapor deposition—Chap. 7), Beica (electrodeposition—Chap. 8), and Wang et al. (chemical mechanical polishing—Chap. 9). Kim et al. from the EV Group completes the unit process spectrum by providing insights into temporary and permanent wafer bonding, both of which are key elements of the TSV process flow. I encourage all prospective readers from industry, academia, and various backgrounds—engineering, sciences, and business—to leverage the broad breath of content in this volume and gain a deeper understanding of TSV technology.

    Heterogeneous Microsystems Highly miniaturized autonomous microsystems with ambient intelligence can be built based on heterogeneous TSS integration. These microsystems utilize "More Than Moore" solutions to enable reconfigurable, adaptable, and self-adjusting interaction with the environment. Key technologies include MEMS, sensors, bio-interfaces, ultra-low-power wireless circuits, energy harvesters, and microbatteries [5]. Because the fabrication processes and materials for these technologies are highly diverse, SiP is often the preferred integration solution.

    9. 9 2 × 2 × 2 3D NOC topology. Each seven-port switch in the network is connected by a bidirectional link to intra-tier switches positioned North, South, East, and West. Two other ports connect each switch in the upper to lower tiers, and one port connects the switch to the processor or memory-resource node. With a shared bus architecture, the performance improvement from adding more processor nodes and more 3D tiers generally diminishes. 3D NOC architecture is significantly more scalable and extends the performance improvement window to greater number of processor cores and 3D tiers [23,24].

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